Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

RM Murugan, M Mi, GP Morrison, J Chen… - US Patent …, 2018 - Google Patents
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire
bond ball grid array package encapsulating the IC die. The wire bond ball grid array …
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Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

RM Murugan, M Mi, GP Morrison, J Chen… - US Patent …, 2018 - freepatentsonline.com
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire
bond ball grid array package encapsulating the IC die. The wire bond ball grid array …

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

RM Murugan, M Mi, GP Morrison, J Chen… - US Patent App. 15 …, 2017 - Google Patents
ABSTRACT A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die
and a wire bondball grid array package encapsulating the IC die. The wire bond ball grid …

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS

RM Murugan, M MI, GP Morrison… - US Patent App. 15 …, 2017 - freepatentsonline.com
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire
bond ball grid array package encapsulating the IC die. The wire bond ball grid array …