Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

RM Murugan, M Mi, GP Morrison, J Chen… - US Patent …, 2017 - Google Patents
BACKGROUND Continued advances in semiconductor manufacturing technologies in
recent years have made it possible to develop monolithic microwave integrated circuits …
被引用次数：59 相关文章

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

RM Murugan, M Mi, GP Morrison, J Chen… - US Patent …, 2017 - freepatentsonline.com
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire
bond ball grid array package encapsulating the IC die. The wire bond ball grid array …

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

RM Murugan, M Mi, GP Morrison, J Chen… - US Patent App. 14 …, 2015 - Google Patents
BACKGROUND 0002 Continued advances in semiconductor manufactur ing technologies in
recent years have made it possible to develop monolithic microwave integrated circuits …

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS

RM Murugan, M MI, GP Morrison… - US Patent App. 14 …, 2015 - freepatentsonline.com
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire
bond ball grid array package encapsulating the IC die. The wire bond ball grid array …