In nanoscale regime, the performance of traditional copper interconnects degrades
substantially in terms of latency, power dissipation and induced crosstalk noise. This is due
to miniaturization of electronic devices and many-fold enhancement of interconnect lengths
in very large-scale integrated (VLSI) circuits. However, carbon nanotubes (CNTs) due to
their unique physical properties such as high thermal conductivity, current carrying capability
and mechanical strength have drawn the attention of researchers in recent times. The …