过去一年中添加的文章，按日期排序

A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages

YJ Chang, CH Liu, YS Lin, CC Wang… - … for Testing and …, 2024 - dl.asminternational.org
9 天前 - … heterogeneous integration offers an attractive solution in advanced IC packaging
because it enables the integration … -generation packages, fan-out wafer-level package (FOWLP…
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FA Challenges and Case Study Exploration of Multidie Fan-Out Wafer Level Packages

B Zee, Q Wen… - … Symposium for Testing …, 2024 - dl.asminternational.org
9 天前 - … FA Challenges and Case Study Exploration of multi-die Fan-out Wafer Level Packages
… , innovations in packaging technologies through heterogeneous integration are being …
相关文章 所有 2 个版本

Reliability Assessment of Heterogeneous Integrated FOWLP Test Structure Packages for Mixed RF Digital Front-End Application

JC Riedl, V Bortolussi, C Chang… - … System-Integration …, 2024 - ieeexplore.ieee.org
51 天前 - … Fan-out wafer level packaging of GaN components for RF applications. In2020
IEEE 70th Electronic Components and Technology Conference (ECTC) 2020 Jun 3 (pp. 7-13). …
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Solutions enabling advanced packaging and heterogeneous integration

KI Mori, D Shelton, M Mizutani, H Suda… - … Japan 2024: XXX …, 2024 - spiedigitallibrary.org
67 天前 - … Wafer-Level-Package) mainly for the package form-factor reduction. However,
advanced packaging is used not only for the package … including Fan-out wafer level packages …
相关文章 所有 3 个版本

Optimization of Dual-Chip Heterogeneous Packaging Power Device Based on 3D Fan-Out Panel Level Packaging (3D FOPLP)

J Zhu, D Shao, K Ding - … Conference on Electronic Packaging …, 2024 - ieeexplore.ieee.org
86 天前 - … packaging can be categorized into two types based on the carrier form: Wafer Level
Packaging … FOPLP technology can flexibly achieve multi-chip heterogeneous integration of …
相关文章 所有 2 个版本

Quantitative evaluation of PI-RDL interfacial delamination in fan-out wafer-level packaging during unbiased highly accelerated stress test

W Wu, W Zhao, K Chen, B Ma, D Lu, K Wang… - Engineering Failure …, 2024 - Elsevier
109 天前 - … Fan-Out Wafer-Level Packaging (FOWLP) is increasingly utilized for its superior
performance, facilitated by flexible heterogeneous integration. Despite its advantages, the …
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Vertical Fan Out (VFO) package with enhanced form factor and performances for mobile applications

KJ Sung, K Eun, JM Kim, SH Jang… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
157 天前 - … for more integrated functionality, better electrical performances and smaller form
factors. Fan out wafer level package (FOWLP) of advanced packaging technologies is one of …
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Fabrication and Packaging of a Heterogeneously Integrated, Flexible Micro-display and Optical Modeling for Quantum Dot Integration

H Sun, H Sonagara, G Ouyang, L Xu… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
157 天前 - … Abstract—We present our work on the heterogeneous integration of GaN microLEDs
… FlexTrateTM, a flexible, diefirst, fan-out wafer level packaging (FOWLP) platform. We also …
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A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers

SBN Gourikutty, J Wu, TG Lim, S Sandra… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
157 天前 - … , it's crucial to utilize heterogeneous integration that allows for … integrated transceiver
module or Optical Engine (OE) that is realized by advanced Fan-out wafer-level packaging …
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Deep Reinforcement Learning-Based Power Distribution Network Design Optimization for Multi-Chiplet System

W Miao, Z Xie, CS Tan… - 2024 IEEE 74th Electronic …, 2024 - ieeexplore.ieee.org
157 天前 - … network (PDN) in a high density fan out wafer level package (HD FOWLP) for a four
… , and some of the strong contenders include heterogeneous integration, 2.5D/3D advanced …
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