The electric copper lines in printed circuit boards (PCBs) introduce anisotropy in the various
layers in multilayered PCBs. This anisotropy in combination with a general lack of symmetry
with respect to the PCB midplane is a cause for thermally induced warpage. An analytical
model which can predict the thermomechanical properties and warpage of PCBs with
various electric artworks was developed. The model is based on Kirchhoff plate theory. An
effective medium assumption was employed for the layers consisting of copper lines and …