Interposer and semiconductor package embodiments provide for the isolation and
suppression of electronic noise such as EM emissions in the semiconductor package. The
interposer includes shield structures in various embodiments, the shield structures blocking
the electrical noise from the noise source, from other electrical signals or devices. The
shields include solid structures and some embodiments and decoupling capacitors in other
embodiments. The coupling structures includes multiple rows of solder balls included in …

BACKGROUND Integrated circuits (“ICs') are incorporated into many elec tronic devices. IC
packaging has evolved such that multiple ICs may be vertically stacked in so-called three-
dimensional (3D) packages in order to save horizontal area on a printed circuit board (PCB).
An alternative packaging technique, referred to as a 2.5 D package, may use an interposer,
which may be formed from a semiconductor material Such as sili con, for coupling one or
more semiconductor die to a PCB. A plurality of IC or other semiconductor die which may be …