Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules
KB Pedersen, PK Kristensen, V Popok… - Microelectronics …, 2013 - Elsevier
A micro-sectioning approach for characterizing the quality or degradation state of
interconnect interfaces in electronic components is described. The method is presented as a
means of investigating the bonding quality of the Al wedge bonding process in IGBT
modules. But in general it is applicable to any type of interface and may be used to assess
the present quality of the interface. The micro-sectioning is based on mechanical polishing,
chemical polishing, electro-etching, and various types of microscopy.
interconnect interfaces in electronic components is described. The method is presented as a
means of investigating the bonding quality of the Al wedge bonding process in IGBT
modules. But in general it is applicable to any type of interface and may be used to assess
the present quality of the interface. The micro-sectioning is based on mechanical polishing,
chemical polishing, electro-etching, and various types of microscopy.
以上显示的是最相近的搜索结果。 查看全部搜索结果