BACKGROUND Continued advances in semiconductor manufacturing technologies in
recent years have made it possible to develop monolithic microwave integrated circuits
(MMICs) using standard CMOS processes at a relatively low cost. However, it remains a
challenge to develop Suitable and affordable techniques for interconnects and packaging of
these MMICs. Cost and packaging protection may be con cerns. MMICs may be useful, for
example, in radar systems. To be commercially viable for consumer applications such as in …

A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire
bond ball grid array package encapsulating the IC die. The wire bond ball grid array
package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter
wave receive channel, wherein each millimeter wave transmit and receive channel
electrically couples the IC die to a signal ball of the solder ball array and is configured to
resonate at an operating frequency band of the millimeter wave IC chip.