A molecular-dynamics simulation of the mechanical properties of nanoscale copper with
vacancies under static and cyclic loading has been carried out. From the tensile test, the
stress–strain curve for nanoscale copper was obtained first and then the Young's modulus of
the material was determined. The Young's modulus decreases with increasing vacancy
fraction, and it also decreases with increasing temperature. It can be clearly seen that the
ultimate tensile stress and elongation rate are high for nanoscale copper, and result in the …