(57) ABSTRACT A multi-layered dielectric layer wherein the adhesion char acteristic of an
insulating layer including a Si-CH bond is improved, and a method of forming the same are
provided. The multi-layered dielectric layer is formed on conductive patterns and includes a
first insulating layer formed of a layer having a low dielectric constant including the Si-CH
bond. In order to improve the adhesion characteristic of the first insulating layer, an adhesion
Surface is formed on the Surface of the first insulating layer by treating the first insulating …