… information on the packaging technology of high power semiconductor lasers. … of high power
semiconductor lasers. Chapter 1 gives a general description on the basics of semiconductor …

… To ascertain the future direction of high power device developments, we will propose a new
… high power devices: BJT, IGBT and CTO. Following this discussion, a new flat IGBT package …

… wide application in IC and memory packaging such as Fairchild Semiconductor’s ball grid
array … in a compact, thin package with high power density and very low resistance. Commercial …

… introduce a hybrid power module packaging concept that allows 300C operation to leverage
recent advances in SiC and other wide band-gap semiconductor materials. We propose a …

… , SiC and GaN devices are the most promising semiconductor materials, as … high power
packages, in order to elevate the operating temperature above 200 C. An advanced packaging …

… electronics in high-efficiency and high-power density applications. In this article, the potential
impact of SiC devices … voltage power semiconductor devices is reviewed. Future trends in …

… packaging for high power density and high temperature. In this work, the status and trend of
SiC power device packaging … temperature semiconductor devices, the packaging materials …

… One of the main failure mechanisms encountered in high power IGBT … packaging power
semiconductor devices. To improve performance and reliability of packaged power electronics…

… This paper has explored an overview to IPM design for high power electronic packaging, a
concept which extends the idea of MCMs to high power electronics assemblies by integrating …

… High power automotive applications have a whole set of special requirements which
drives the power module requirements. Technically most demanding are high ambient …