Planarized, extendible, multilayer fabrication process for superconducting electronics

DT Yohannes, RT Hunt, JA Vivalda… - … Superconductivity, 2014 - ieeexplore.ieee.org
… -film resistors, and interconnects, with increasing … superconducting layers using layer
planarization techniques. Japanese Advanced Process (ADP) has demonstrated up to 10 Nb layers

Progress toward superconductor electronics fabrication process with planarized NbN and NbN/Nb layers

SK Tolpygo, JL Mallek, V Bolkhovsky… - … Superconductivity, 2023 - ieeexplore.ieee.org
… on 200-mm wafers, described in [19], [20], was followed up to the metal layer M6, the layer
interconnecting Josephson junctions and shunt resistors; see [19, Fig. 1], and [20, Fig. 1]. …

First principle investigation of tungsten based cubic oxide perovskite materials for superconducting applications: A DFT study

MK Shahzad, S Hussain, MU Farooq… - Journal of Physics and …, 2024 - Elsevier
… also electrical properties, including superconducting, metallic, insulating, and semiconducting
… Furthermore, several single-phase materials that exhibit multi-conductive activity include …