Various magnetron sputtering tools have been developed that provide a high degree of
ionization of the sputtered vapor referred to as ionized physical vapor deposition (IPVD). The
ions can be controlled with respect to energy and direction as they arrive to the growth
surface which allows for increased control of film properties during growth. Here, the design
parameters for IPVD systems are briefly reviewed. The first sputter based IPVD systems
utilized a secondary plasma source between the target and the substrate in order to …