A three-dimensional architecture chip includes a base chip including a unit integrated
thereon and configured to perform electrical signal operations. An active layer is separately
fabricated from the base layer. The active layer includes a component to service the unit of
the base chip. The active layer is bonded to the base chip such that the compo nent is
aligned in Vertical proximity of the unit. An electrical connection connects the unit to the
component through ver tical layers of at least one of the base chip and the active layer …