Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices

AR Krauss, O Auciello, DM Gruen, A Jayatissa… - Diamond and Related …, 2001 - Elsevier
MEMS devices are currently fabricated primarily in silicon because of the available surface
machining technology. A major problem with the Si-based MEMS technology is that Si has
poor mechanical and tribological properties [JJ Sniegowski, in: B. Bushan (Ed.), Tribology
Issues and Opportunities in MEMS, Kluwer Academic Publisher, The Netherlands, 1998, p.
325; AP Lee, AP Pisano, MG Lim, Mater. Res. Soc. Symp. Proc. 276 (1992) 67.], and
practical MEMS devices are currently limited primarily to applications involving only bending …
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