Interconnect-aware device targeting from PPA perspective
M Badaroglu, J Xu - 2016 IEEE/ACM International Conference …, 2016 - ieeexplore.ieee.org
CMOS scaling so far enabled simultaneous system throughput scaling by concurrent
improvements in delay, power, and area with thanks to Moore's law. CMOS scaling becomes …
improvements in delay, power, and area with thanks to Moore's law. CMOS scaling becomes …
The ITRS MPU and SOC system drivers: Calibration and implications for design-based equivalent scaling in the roadmap
The system driver models for microprocessor (MPU) and system-on-chip (SOC) in the
International Technology Roadmap for Semiconductors [21](ITRS) determine the roadmap …
International Technology Roadmap for Semiconductors [21](ITRS) determine the roadmap …
Interconnect-aware technology and design co-optimization for the 5-nm technology and beyond
M Badaroglu - Journal of Low Power Electronics, 2018 - ingentaconnect.com
CMOS scaling so far enabled simultaneous system throughput scaling by concurrent
improvements in delay, power, and area with thanks to Moore's law. CMOS scaling becomes …
improvements in delay, power, and area with thanks to Moore's law. CMOS scaling becomes …
Extending technology roadmap by selective device footprint scaling and parasitics engineering
J Deng, L Wei, LW Chang, K Kim… - … Symposium on VLSI …, 2008 - ieeexplore.ieee.org
We propose a path for extending the technology roadmap when currently considered
technology boosters (eg, strain, high-k/metal gate) reach their limits. By carefully …
technology boosters (eg, strain, high-k/metal gate) reach their limits. By carefully …
Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5 D/3D integration
Due to the increasing fabrication and design complexity with new process nodes, the cost
per transistor trend originally identified in Moore's Law is slowing when using traditional …
per transistor trend originally identified in Moore's Law is slowing when using traditional …
Pathfinding for 22nm CMOS designs using predictive technology models
Traditional IC scaling is becoming increasingly difficult at the 22 nm node and beyond.
Dealing with these challenges increase product development cycle time. For continued …
Dealing with these challenges increase product development cycle time. For continued …
Design for manufacturing and reliability for nanometer SoCs (system-on-chips)
Y Ban - 2015 International SoC Design Conference (ISOCC), 2015 - ieeexplore.ieee.org
As the device dimension increases and chip sizes shrink, on-chip semiconductor process
variation can no longer be ignored in the design and signoff static timing analysis of …
variation can no longer be ignored in the design and signoff static timing analysis of …
More Moore landscape for system readiness-ITRS2. 0 requirements
CMOS scaling enabled simultaneous system throughput scaling by concurrent delay, power,
and area shrinks with thanks to Moore's law. System scaling is getting more difficult with the …
and area shrinks with thanks to Moore's law. System scaling is getting more difficult with the …
System-level Innovation for the Next Decade AI Performance, Power, Area with Co-optimization
M Pan - 2023 60th ACM/IEEE Design Automation Conference …, 2023 - ieeexplore.ieee.org
Power, performance, and area (PPA) are three key parameters in conventional system-on-
chip design optimization. In post Moore's law era, system-level PPA improvement for system …
chip design optimization. In post Moore's law era, system-level PPA improvement for system …
Technology modeling and characterization beyond the 45nm node
SR Nassif - 2008 Asia and South Pacific Design Automation …, 2008 - ieeexplore.ieee.org
The semiconductor industry is unique in that it produces products with little or no prototyping!
While a car company will build (and crash) many prototypes before converging on a final …
While a car company will build (and crash) many prototypes before converging on a final …