Interconnect-aware device targeting from PPA perspective

M Badaroglu, J Xu - 2016 IEEE/ACM International Conference …, 2016 - ieeexplore.ieee.org
CMOS scaling so far enabled simultaneous system throughput scaling by concurrent
improvements in delay, power, and area with thanks to Moore's law. CMOS scaling becomes …

The ITRS MPU and SOC system drivers: Calibration and implications for design-based equivalent scaling in the roadmap

WTJ Chan, AB Kahng, S Nath… - 2014 IEEE 32nd …, 2014 - ieeexplore.ieee.org
The system driver models for microprocessor (MPU) and system-on-chip (SOC) in the
International Technology Roadmap for Semiconductors [21](ITRS) determine the roadmap …

Interconnect-aware technology and design co-optimization for the 5-nm technology and beyond

M Badaroglu - Journal of Low Power Electronics, 2018 - ingentaconnect.com
CMOS scaling so far enabled simultaneous system throughput scaling by concurrent
improvements in delay, power, and area with thanks to Moore's law. CMOS scaling becomes …

Extending technology roadmap by selective device footprint scaling and parasitics engineering

J Deng, L Wei, LW Chang, K Kim… - … Symposium on VLSI …, 2008 - ieeexplore.ieee.org
We propose a path for extending the technology roadmap when currently considered
technology boosters (eg, strain, high-k/metal gate) reach their limits. By carefully …

Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5 D/3D integration

D Stow, I Akgun, R Barnes, P Gu… - 2016 IEEE/ACM …, 2016 - ieeexplore.ieee.org
Due to the increasing fabrication and design complexity with new process nodes, the cost
per transistor trend originally identified in Moore's Law is slowing when using traditional …

Pathfinding for 22nm CMOS designs using predictive technology models

X Li, W Zhao, Y Cao, Z Zhu, J Song… - 2009 IEEE Custom …, 2009 - ieeexplore.ieee.org
Traditional IC scaling is becoming increasingly difficult at the 22 nm node and beyond.
Dealing with these challenges increase product development cycle time. For continued …

Design for manufacturing and reliability for nanometer SoCs (system-on-chips)

Y Ban - 2015 International SoC Design Conference (ISOCC), 2015 - ieeexplore.ieee.org
As the device dimension increases and chip sizes shrink, on-chip semiconductor process
variation can no longer be ignored in the design and signoff static timing analysis of …

More Moore landscape for system readiness-ITRS2. 0 requirements

M Badaroglu, K Ng, M Salmani, SG Kim… - 2014 IEEE 32nd …, 2014 - ieeexplore.ieee.org
CMOS scaling enabled simultaneous system throughput scaling by concurrent delay, power,
and area shrinks with thanks to Moore's law. System scaling is getting more difficult with the …

System-level Innovation for the Next Decade AI Performance, Power, Area with Co-optimization

M Pan - 2023 60th ACM/IEEE Design Automation Conference …, 2023 - ieeexplore.ieee.org
Power, performance, and area (PPA) are three key parameters in conventional system-on-
chip design optimization. In post Moore's law era, system-level PPA improvement for system …

Technology modeling and characterization beyond the 45nm node

SR Nassif - 2008 Asia and South Pacific Design Automation …, 2008 - ieeexplore.ieee.org
The semiconductor industry is unique in that it produces products with little or no prototyping!
While a car company will build (and crash) many prototypes before converging on a final …