The need and opportunities of electromigration-aware integrated circuit design

S Bigalke, J Lienig, G Jerke, J Scheible… - 2018 IEEE/ACM …, 2018 - ieeexplore.ieee.org
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …
被引用次数：14 相关文章
[PDF] researchgate.net

[PDF][PDF] The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - researchgate.net
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM veri cation …
[PDF] ifte.de

[PDF][PDF] The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - ifte.de
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …
[PDF] ifte.de

[PDF][PDF] The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - ifte.de
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …

The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible… - 2018 IEEE/ACM …, 2018 - dl.acm.org
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …

The need and opportunities of electromigration-aware integrated circuit design

S Bigalke, J Lienig, G Jerke… - Proceedings …, 2018 - publikationen.reutlingen-university …
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …

The need and opportunities of electromigration-aware integrated circuit design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - publica.fraunhofer.de
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …
[PDF] academia.edu

[PDF][PDF] The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - academia.edu
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …
[PDF] ifte.de

[PDF][PDF] The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - ifte.de
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …
[PDF] ifte.de

[PDF][PDF] The Need and Opportunities of Electromigration-Aware Integrated Circuit Design

S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke - 2018 - ifte.de
Electromigration (EM) is becoming a progressively severe reliability challenge due to
increased interconnect current densities. A shift from traditional (post-layout) EM verification …