The explosive growth and adoption of smartphones provides access to voice and data for billions of people worldwide today and connected devices are expect to reach 5.6 billion in 2020. This growth has been and continues to be the engine for semiconductor industry due to required computational power of CMOS technology in lower feature nodes as FinFet 7nm/14nm for application processors, modems and transceivers. The adoption of 5G will bring higher data capacity and low latency using sub-6GHz bands and mmWave spectrum, with the first expected to be deployed in next generation 5G smartphones. This 5G evolution will open up new applications where our phones will be a conduit for massive amounts of data. With lower feature nodes for RF CMOS there is an increased usage of digital signal processing (DSP) and RF digital calibration which are part of modern modem technology. 5G requires more RF bands, so there is a clear shift in terms of what parts of the RF systems are portioned in advanced CMOS nodes and what RF and analogue blocks are integrated with other components such as acoustic duplexers and filters in multiple RF front-end-modules (RF FEMs). This paper proposes a low cost RF partitioning and architecture which will be part of 5G RF FEMs. This paper also presents some design/measurement results and explains how these modules can be integrated into a complex 4G/5G system RF front end (RFFE) for mobile applications.