Construction material properties of slag from the high temperature arc gasification of municipal solid waste

JG Roessler, FD Olivera, SJ Wasman, TG Townsend… - Waste management, 2016 - Elsevier
Waste management, 2016Elsevier
Slag from the high temperature arc gasification (HTAG) of municipal solid waste (MSW) was
tested to evaluate its material properties with respect to use as a construction aggregate.
These data were compared to previously compiled values for waste to energy bottom ash,
the most commonly produced and beneficially used thermal treatment residue. The slag was
tested using gradations representative of a base course and a course aggregate. Los
Angeles (LA) abrasion testing demonstrated that the HTAG slag had a high resistance to …
Abstract
Slag from the high temperature arc gasification (HTAG) of municipal solid waste (MSW) was tested to evaluate its material properties with respect to use as a construction aggregate. These data were compared to previously compiled values for waste to energy bottom ash, the most commonly produced and beneficially used thermal treatment residue. The slag was tested using gradations representative of a base course and a course aggregate. Los Angeles (LA) abrasion testing demonstrated that the HTAG slag had a high resistance to fracture with a measured LA loss of 24%. Soundness testing indicated a low potential for reactivity and good weathering resistance with a mean soundness loss of 3.14%. The modified Proctor compaction testing found the slag to possess a maximum dry density (24.04 kN/m3) greater than conventionally used aggregates and WTE BA. The LBR tests demonstrated a substantial bearing capacity (>200). Mineralogical analysis of the HTAG suggested the potential for self cementing character which supports the elevated LBR results. Preliminary material characterization of the HTAG slag establishes potential for beneficial use; larger and longer term studies focusing on the material’s possibility for swelling and performance at the field scale level are needed.
Elsevier
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