Highly thermal conductive thermal interface materials are playing an irreplaceable role in
modern highly integrated microelectronic devices. A facile method was used to fabricate a
highly thermal conductive composite combined with highly thermal conductivity and
excellent flexibility. The carbon fiber/polydimethylsiloxane (CF/PDMS) composites were
prepared by solution blending with PDMS as matrix and different contents CF as thermal
conductive fillers. Thermal conductivity of the PDMS composite is up to 2.73 W/mK with 20 …