High-temperature dielectric polyimide films for energy storage applications
DH Wang, BA Kurish, I Treufeld, L Yang… - MRS Online …, 2013 - cambridge.org
MRS Online Proceedings Library (OPL), 2013•cambridge.org
Two new diamines containing three nitriles are synthesized via a 3-step route. They are
polymerized with four commercial dianhydrides (ie 6FDA, OPDA, BTDA and PMDA) in N, N-
dimethylacetamide (DMAc) to afford poly (amic acid) s, which are thermally cured at
temperatures up to 300° C to form tough, creasable films. Most of these polyimides are
soluble in common solvents. Their glass transition temperatures range from 216 to 341° C.
The polyimides are stable up to 400° C. The dielectric constants of these OPDA-based …
polymerized with four commercial dianhydrides (ie 6FDA, OPDA, BTDA and PMDA) in N, N-
dimethylacetamide (DMAc) to afford poly (amic acid) s, which are thermally cured at
temperatures up to 300° C to form tough, creasable films. Most of these polyimides are
soluble in common solvents. Their glass transition temperatures range from 216 to 341° C.
The polyimides are stable up to 400° C. The dielectric constants of these OPDA-based …
Two new diamines containing three nitriles are synthesized via a 3-step route. They are polymerized with four commercial dianhydrides (i.e. 6FDA, OPDA, BTDA and PMDA) in N,N-dimethylacetamide (DMAc) to afford poly(amic acid)s, which are thermally cured at temperatures up to 300 °C to form tough, creasable films. Most of these polyimides are soluble in common solvents. Their glass transition temperatures range from 216 to 341 °C. The polyimides are stable up to 400 °C. The dielectric constants of these OPDA-based polyimides increase from 2.9 (CP2) to 4.7 as measured by the D-E loops.
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