… between the different transmission media (mainly the bottom and top package surfaces, … 2,
which include the Duroid to the bottom surface of the ceramic through a package interconnect …

… a lot of time with and received tremendous encouragement from. Last … The objective of
microwave packaging is to transfer … are the small outline integrated circuit package (SOIC) and its …

… the handling of sensitive microwave integrated circuits (IC’s) … -volume microwave and
millimeterwave frequency applications … than transition modeling and has received little attention. A …

… PCB through ball-grid arrays (BGAs) to form a larger array. … At the same time, antenna design
must take into account not … range, with parameters including transmission line width, pad …

… mm-wave active integrated antennas also have received much … of the transmission line, a
multistage quarterwavelength … integration of high-speed and RF integrated circuits and systems…

… bump and the Transmission line (T-line) losses to get to the … molding is illustrated in the land
grid array (LGA) approach of … for use on PCBs and integrated circuits (ICs) such as silicon (…

… and the integration in a package with receiver circuits to build a … The design of the integrated
circuits is not part of this paper. … Transmit and receive path can both be BPSK modulated by …

… -scale packaging (WLCSP) technology has matured 102 in the field of integrated circuits (…
It can be seen 175 that the RF energy from the solder ball is transmitted through 176 the …

… transmission rates of over 1 Gbps, such as those for data transfers, streaming, and content
downloads. Gallium arsenide integrated circuits (ICs) for millimeter-wave … and millimeter wave …

… antennas, take into account … transmit (TX) antennas and two single-end fed receive (RX)
antennas for normal and end-fire radiation, respectively. The antenna integration in the package …