Future electronics devices are not only smaller and thinner, but are also flexible, bendable and even wearable. This evolution in technology requires direct printing of patterns onto any substrate using conductive inks made of a dispersion of metallic nanoparticles. In this study, Cl-ions was used to induce spontaneous sintering of silver nanoparticles (Ag NPs). Ag NPs with an average diameter of 56 nm were synthesized by polyol method using silver nitrate (AgNO3) and ethylene glycol (EG) as precursor and solvent, respectively. Poly (vinyl pyrrolidone) was used as the capping agent. Water-based inks were formulated containing different Ag NP loading (10–25 wt%). Using 50 mM NaCl aqueous solution as the dispersing medium, an ink with 15 wt% Ag exhibited a sheet resistance of about 2.85 Ω/sq. This very low sheet resistance was attributed to sintering of Ag NPs, which was accompanied by an increase in average diameter of nanoparticles from 56 to 569 nm.