The influence of maleic acid on the Co–P electroless deposition
E Rudnik, J Gorgosz - Surface and Coatings Technology, 2007 - Elsevier
E Rudnik, J Gorgosz
Surface and Coatings Technology, 2007•ElsevierThe influence of maleic acid on the electroless deposition of Co–P was investigated. The
changes of the stationary potential, the deposition rates and the plating efficiencies with the
concentration of the additive were determined. The correlation with the Tafel-like equation
was found. The dependence of the morphology of the as-plated deposits on the additive
concentration was observed. The effect of succinic acid (at only one concentration) was also
analyzed.
changes of the stationary potential, the deposition rates and the plating efficiencies with the
concentration of the additive were determined. The correlation with the Tafel-like equation
was found. The dependence of the morphology of the as-plated deposits on the additive
concentration was observed. The effect of succinic acid (at only one concentration) was also
analyzed.
The influence of maleic acid on the electroless deposition of Co–P was investigated. The changes of the stationary potential, the deposition rates and the plating efficiencies with the concentration of the additive were determined. The correlation with the Tafel-like equation was found. The dependence of the morphology of the as-plated deposits on the additive concentration was observed. The effect of succinic acid (at only one concentration) was also analyzed.
Elsevier
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