The influence of the sputtering process on the constitution of the compound layers obtained by plasma nitriding
Using a relative simple experimental method, the sputtering rate has been measured under
specific plasma nitriding conditions. The influence of gas composition and total pressure on
the sputtering rate has been investigated. Depending on these factors, the sputtering rate
varies in the range of 0.02–0.12 μm/h. The sputtered material has been analyzed as well.
The results indicated that the phase constitution of this material is similar to that of the
compound layer.
specific plasma nitriding conditions. The influence of gas composition and total pressure on
the sputtering rate has been investigated. Depending on these factors, the sputtering rate
varies in the range of 0.02–0.12 μm/h. The sputtered material has been analyzed as well.
The results indicated that the phase constitution of this material is similar to that of the
compound layer.
Using a relative simple experimental method, the sputtering rate has been measured under specific plasma nitriding conditions. The influence of gas composition and total pressure on the sputtering rate has been investigated. Depending on these factors, the sputtering rate varies in the range of 0.02–0.12 μm/h. The sputtered material has been analyzed as well. The results indicated that the phase constitution of this material is similar to that of the compound layer.
Elsevier
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