Introduction to electromigration-aware physical design
J Lienig - Proceedings of the 2006 international symposium on …, 2006 - dl.acm.org
Electromigration is increasingly relevant to the physical design of electronic circuits. It is
caused by excessive current density stress in the interconnect. The ongoing reduction of …
caused by excessive current density stress in the interconnect. The ongoing reduction of …
Interconnect and current density stress: An introduction to electromigration-aware design
J Lienig - Proceedings of the 2005 international workshop on …, 2005 - dl.acm.org
Electromigration due to excessive current density stress in the interconnect can cause the
premature failure of an electronic circuit. The ongoing reduction of circuit feature sizes has …
premature failure of an electronic circuit. The ongoing reduction of circuit feature sizes has …
Electromigration-aware physical design of integrated circuits
J Lienig, G Jerke - … Conference on VLSI Design held jointly with …, 2005 - ieeexplore.ieee.org
The electromigration effect within current-density-stressed signal and power lines is an
ubiquitous and increasingly important reliability and design problem in sub-micron IC …
ubiquitous and increasingly important reliability and design problem in sub-micron IC …
Electromigration and its impact on physical design in future technologies
J Lienig - Proceedings of the 2013 ACM International symposium …, 2013 - dl.acm.org
Electromigration (EM) is one of the key concerns going forward for interconnect reliability in
integrated circuit (IC) design. Although analog designers have been aware of the EM …
integrated circuit (IC) design. Although analog designers have been aware of the EM …
[图书][B] Fundamentals of electromigration
J Lienig, M Thiele, J Lienig, M Thiele - 2018 - Springer
This chapter investigates in detail the actual low-level migration processes. A solid
grounding in the physics of electromigration (EM) and its specific effects on the interconnect …
grounding in the physics of electromigration (EM) and its specific effects on the interconnect …
The pressing need for electromigration-aware physical design
J Lienig, M Thiele - Proceedings of the 2018 International Symposium on …, 2018 - dl.acm.org
Electromigration (EM) is becoming a progressively intractable design challenge due to
increased interconnect current densities. It has changed from something designers" should" …
increased interconnect current densities. It has changed from something designers" should" …
A practical approach to static signal electromigration analysis
N Ns, F Cano, H Haznedar, D Young - Proceedings of the 35th annual …, 1998 - dl.acm.org
It is commonly thought that sweep-back effects would make electromigration (EM) a non-
issue in signal lines. However this is only the case when the shape of the positive and …
issue in signal lines. However this is only the case when the shape of the positive and …
Electromigration wreaks havoc on IC design.
J Lloyd, D Overhauser - EDN, 1998 - elibrary.ru
Electromigration wreaks havoc on IC design. КОРЗИНА ПОИСК НАВИГАТОР ЖУРНАЛЫ
КНИГИ ПАТЕНТЫ ПОИСК АВТОРЫ ОРГАНИЗАЦИИ КЛЮЧЕВЫЕ СЛОВА РУБРИКАТОР …
КНИГИ ПАТЕНТЫ ПОИСК АВТОРЫ ОРГАНИЗАЦИИ КЛЮЧЕВЫЕ СЛОВА РУБРИКАТОР …
On potential design impacts of electromigration awareness
Reliability issues significantly limit performance improvements from Moore's-Law scaling. At
45nm and below, electromigration (EM) is a serious reliability issue which affects global and …
45nm and below, electromigration (EM) is a serious reliability issue which affects global and …
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs
Electromigration (EM) is a critical problem for interconnect reliability of modern integrated
circuits (ICs), especially as the feature size becomes smaller. In three-dimensional (3D) IC …
circuits (ICs), especially as the feature size becomes smaller. In three-dimensional (3D) IC …