[引用][C] Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM

B Soufyane, T Abdellaha, D Franck - 2014 - dspace.univ-temouchent.edu.dz
Abstract 3D microelectronic components are exposed to electrical, thermal, mechanical and
chemical stresses generated by storage, transport, manipulation, functioning and …
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[引用][C] Design for Thermo-Mechanical Reliability of a 3D Microelectronic Component Using 3DFEM

B Soufyanea, T Abdellaha, D Franckb - dspace.univ-temouchent.edu.dz
Abstract 3D microelectronic components are exposed to electrical, thermal, mechanical and
chemical stresses generated by storage, transport, manipulation, functioning and …