3D LED and IC wafer level packaging

J Lau, R Lee, M Yuen, P Chan - Microelectronics International, 2010 - emerald.com
Purpose–The purpose of this paper is to propose new 3D light emitting diodes (LED) and
integrated circuits (IC) integration packages. Design/methodology/approach–These …
被引用次数：78 相关文章

3D LED and IC wafer level packaging

J Lau, R Lee, M Yuen, P Chan - Microelectronics International, 2010 - ingentaconnect.com
Purpose‐The purpose of this paper is to propose new 3D light emitting diodes (LED) and
integrated circuits (IC) integration packages. Design/methodology/approach‐These …

3D LED and IC wafer level packaging

J Lau, S Lee, MF Yuen, PCH Chan - Microelectronics International, 2010 - repository.ust.hk
Purpose-The purpose of this paper is to propose new 3D light emitting diodes (LED) and
integrated circuits (IC) integration packages. Design/methodology/approach-These …

3D LED and IC wafer level packaging

J Lau, R Lee, M Yuen… - Microelectronics …, 2010 - research.polyu.edu.hk
Purpose-The purpose of this paper is to propose new 3D light emitting diodes (LED) and
integrated circuits (IC) integration packages. Design/methodology/approach-These …

[引用][C] 3D LED and IC wafer level packaging

J LAU, R LEE, M YUEN… - Microelectronics …, 2010 - pascal-francis.inist.fr
3D LED and IC wafer level packaging CNRS Inist Pascal-Francis CNRS Pascal and Francis
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[引用][C] 3D LED and IC wafer level packaging

J Lau, R Lee, M Yuen, P Chan - …, 2010 - Emerald Group Publishing, Limited