Suppressing dendritic growth during alkaline zinc electrodeposition using polyethylenimine additive
SJ Banik, R Akolkar - Electrochimica Acta, 2015 - Elsevier
Dendritic morphology evolution during zinc electrodeposition is a major roadblock in the
development of rechargeable zinc anodes in alkaline zinc batteries. In the present work, we …
development of rechargeable zinc anodes in alkaline zinc batteries. In the present work, we …
Sulfonate compounds embraced from acid copper electroplating baths as innovative additives for alkaline Zn batteries
K Bogomolov, E Grishina, Y Ein-Eli - Journal of Materials Chemistry A, 2023 - pubs.rsc.org
Nickel–zinc (Ni–Zn) batteries are rechargeable (secondary) aqueous batteries with high
theoretical power density and a considerably low cost in addition to being safe and rather …
theoretical power density and a considerably low cost in addition to being safe and rather …
A comparison of typical additives for copper electroplating based on theoretical computation
Z Lai, S Wang, C Wang, Y Hong, G Zhou… - Computational Materials …, 2018 - Elsevier
Electronic parameters of four additives for copper electroplating including accelerators,
mercaptopropane sulfonic acid (MPS) and bis-(acid-sulfopropyl)-disulfide (SPS), inhibitor …
mercaptopropane sulfonic acid (MPS) and bis-(acid-sulfopropyl)-disulfide (SPS), inhibitor …
3-Mercapto-1-propanesulfonate for Cu electrodeposition studied by in situ shell-isolated nanoparticle-enhanced Raman spectroscopy, density functional theory …
KG Schmitt, R Schmidt, HF Von-Horsten… - The Journal of …, 2015 - ACS Publications
We investigate the mechanism of 3-mercapto-1-propanesulfonate (MPS) acceleration of Cu
electrodeposition in the presence of Cl–through comparison with the inactive but related …
electrodeposition in the presence of Cl–through comparison with the inactive but related …
Electrochemical behavior of citric acid and its influence on Cu electrodeposition for damascene metallization
The electrolyte for Cu superfilling generally consists of copper sulfate, sulfuric acid, a
chloride ion, an accelerator, and a suppressor. In this study, the characteristics of citric acid …
chloride ion, an accelerator, and a suppressor. In this study, the characteristics of citric acid …
Degradation of poly (ethylene glycol–propylene glycol) copolymer and its influences on copper electrodeposition
In this work, the degradation of poly (ethylene glycol–propylene glycol) copolymer (PEG–
PPG) and its effect on the electrodeposition of Cu were investigated. PEG–PPG became …
PPG) and its effect on the electrodeposition of Cu were investigated. PEG–PPG became …
Pulsed galvanostatic electrodeposition of copper on cobalt using a pH-neutral plating bath and electroless seeds
Due to its notable retention of electrical conductivity in nanoscale features, cobalt is a
leading material candidate for diffusion barriers in the sub-14 nm node copper …
leading material candidate for diffusion barriers in the sub-14 nm node copper …
Tributyl (hexyl) phosphonium chloride as a new leveler for microvia copper superconformal electronic plating
T Song, ZY Wang, JQ Yang, Y Zhao, FZ Yang… - Journal of …, 2024 - Elsevier
A phosphorus-containing new compound of tributyl (hexyl) phosphonium chloride (TBHP),
but not the commonly used nitrogen-containing heterocycles and quaternary ammonium …
but not the commonly used nitrogen-containing heterocycles and quaternary ammonium …
Superconformal copper electrodeposition in complexed alkaline electrolyte
This paper examines superconformal filling of trenches during copper electrodeposition from
alkaline cupric tartrate electrolyte. Localized bottom-up filling of submicrometer damascene …
alkaline cupric tartrate electrolyte. Localized bottom-up filling of submicrometer damascene …
Direct copper pattern plating on glass and ceramic substrates using an Al-doped ZnO as an adhesive and conducting layer
CW Cheng, PF Chan, WP Dow - Journal of The Electrochemical …, 2017 - iopscience.iop.org
Abstract Three substrates, Al 2 O 3, AlN and glass, were directly metallized by copper
electroplating using Al-doped ZnO (AZO) as an adhesive and conducting layer between …
electroplating using Al-doped ZnO (AZO) as an adhesive and conducting layer between …