Suppressing dendritic growth during alkaline zinc electrodeposition using polyethylenimine additive

SJ Banik, R Akolkar - Electrochimica Acta, 2015 - Elsevier
Dendritic morphology evolution during zinc electrodeposition is a major roadblock in the
development of rechargeable zinc anodes in alkaline zinc batteries. In the present work, we …

Sulfonate compounds embraced from acid copper electroplating baths as innovative additives for alkaline Zn batteries

K Bogomolov, E Grishina, Y Ein-Eli - Journal of Materials Chemistry A, 2023 - pubs.rsc.org
Nickel–zinc (Ni–Zn) batteries are rechargeable (secondary) aqueous batteries with high
theoretical power density and a considerably low cost in addition to being safe and rather …

A comparison of typical additives for copper electroplating based on theoretical computation

Z Lai, S Wang, C Wang, Y Hong, G Zhou… - Computational Materials …, 2018 - Elsevier
Electronic parameters of four additives for copper electroplating including accelerators,
mercaptopropane sulfonic acid (MPS) and bis-(acid-sulfopropyl)-disulfide (SPS), inhibitor …

3-Mercapto-1-propanesulfonate for Cu electrodeposition studied by in situ shell-isolated nanoparticle-enhanced Raman spectroscopy, density functional theory …

KG Schmitt, R Schmidt, HF Von-Horsten… - The Journal of …, 2015 - ACS Publications
We investigate the mechanism of 3-mercapto-1-propanesulfonate (MPS) acceleration of Cu
electrodeposition in the presence of Cl–through comparison with the inactive but related …

Electrochemical behavior of citric acid and its influence on Cu electrodeposition for damascene metallization

MJ Kim, S Choe, HC Kim, SK Cho… - Journal of The …, 2015 - iopscience.iop.org
The electrolyte for Cu superfilling generally consists of copper sulfate, sulfuric acid, a
chloride ion, an accelerator, and a suppressor. In this study, the characteristics of citric acid …

Degradation of poly (ethylene glycol–propylene glycol) copolymer and its influences on copper electrodeposition

S Choe, MJ Kim, HC Kim, T Lim, KJ Park… - Journal of …, 2014 - Elsevier
In this work, the degradation of poly (ethylene glycol–propylene glycol) copolymer (PEG–
PPG) and its effect on the electrodeposition of Cu were investigated. PEG–PPG became …

Pulsed galvanostatic electrodeposition of copper on cobalt using a pH-neutral plating bath and electroless seeds

DE Simpson, CA Johnson, D Roy - Journal of The …, 2018 - iopscience.iop.org
Due to its notable retention of electrical conductivity in nanoscale features, cobalt is a
leading material candidate for diffusion barriers in the sub-14 nm node copper …

Tributyl (hexyl) phosphonium chloride as a new leveler for microvia copper superconformal electronic plating

T Song, ZY Wang, JQ Yang, Y Zhao, FZ Yang… - Journal of …, 2024 - Elsevier
A phosphorus-containing new compound of tributyl (hexyl) phosphonium chloride (TBHP),
but not the commonly used nitrogen-containing heterocycles and quaternary ammonium …

Superconformal copper electrodeposition in complexed alkaline electrolyte

D Josell, TP Moffat - Journal of The Electrochemical Society, 2014 - iopscience.iop.org
This paper examines superconformal filling of trenches during copper electrodeposition from
alkaline cupric tartrate electrolyte. Localized bottom-up filling of submicrometer damascene …

Direct copper pattern plating on glass and ceramic substrates using an Al-doped ZnO as an adhesive and conducting layer

CW Cheng, PF Chan, WP Dow - Journal of The Electrochemical …, 2017 - iopscience.iop.org
Abstract Three substrates, Al 2 O 3, AlN and glass, were directly metallized by copper
electroplating using Al-doped ZnO (AZO) as an adhesive and conducting layer between …