Fan-out panel-level packaging (FO-PLP) has become a critical forward-looking technology
because it can meet the demands for small size, high input–output counts, and multichip …

In this chapter, advanced packaging is defined. The kinds of advanced packaging are
ranked based on their interconnect density and electrical performance, and are grouped into …

With the continuous development of advanced packaging technology in heterogeneous
semiconductor integration, the delamination failure problem in a dynamic service …

A low-loss fan-out wafer-level package (FOWLP) has been proposed for millimeter-wave
application. To ensure the radio frequency (RF) signal transition in a ground-signal-ground …

With the increasing popularity and applications of 2.5-D integration, both chip and
packaging industries are making significant progress in this direction. In advanced high …

In the post-Moore era, the development of active phased array antennas will inevitably trend
towards active array microsystems. In this paper, the characteristics and composition of the …

In advanced packaging technology, the micro bump has become an important means of chip
stacking and wafer interconnection. The reliability of micro bumps, which plays an important …

The increasing demand over the higher density and smaller form factor of memory packages
have become a mainstream due to the boom of artificial intelligence and 5G/6G. While form …

Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion
(CTE) were prepared by dissolving polyimide precursor-poly (amide ester)(PAE) resins …

This article proposes a comprehensive analysis and prediction method for wafer-level
radiated electromagnetic interference (EMI) based on integrated circuit (IC) source …