5-in-1 Fan-Out Wafer-Level Packaging Technology with One AI Chip and Four Memory Chips for Internet of Things Modules
K Mori, S Yamashita, M Sekiguchi - Transactions of The Japan …, 2021 - jstage.jst.go.jp
We have developed a 5-in-1 fan-out wafer-level packaging (FOWLP) that integrates one fully
operative artificial intelligence (AI) chip with approximately 2,500 pins and four memory …
operative artificial intelligence (AI) chip with approximately 2,500 pins and four memory …
Study on Enhancing Adhesion and Reliability in Wafer-Level Fan-Out Packaging
W Cui, Z Liu, J Zhou, H Liu, Y Sun… - Journal of …, 2024 - clausiuspress.com
Wafer-level Fan-out packaging (FOWLP) with multi-layer redistribution layers (RDL)
emerges as a pivotal technology in 3D integration. Polyimide (PI) as an insulation layer in …
emerges as a pivotal technology in 3D integration. Polyimide (PI) as an insulation layer in …
Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment
HS Park, SE Kim - Journal of the Microelectronics and Packaging …, 2019 - koreascience.kr
To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $
N_2 $ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The …
N_2 $ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The …
Via Interconnections for Half-Inch Packaging of Electronic Devices Using Minimal Fab Process Tools
F Imura, M Inoue, S Khumpuang… - Journal of photopolymer …, 2020 - jstage.jst.go.jp
Reliability of a laser-via formation process for Fan-Out Wafer Level Packaging (FOWLP)
technology was evaluated using Minimal Fab (MF) that is cleanroom-less and uses a half …
technology was evaluated using Minimal Fab (MF) that is cleanroom-less and uses a half …
Fan-Out Wafer/Panel-Level Packaging for Heterogeneous Integrations
JH Lau, JH Lau - Heterogeneous Integrations, 2019 - Springer
Fan-Out Wafer/Panel-Level Packaging for Heterogeneous Integrations | SpringerLink Skip to
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Research on reliability evaluation method of fan-out package based on sub-model
Q Liu, B Wan, Z Zhang, G Fu - 2021 Global Reliability and …, 2021 - ieeexplore.ieee.org
As a kind of advanced packaging, fan-out package has great advantages in 5G and
intelligent wearable fields because of its small package size, short interconnection and high …
intelligent wearable fields because of its small package size, short interconnection and high …
[图书][B] Integrated Microsystem Technologies for Continuous Personal Monitoring of Airborne Pollutant Exposures
H Yin - 2021 - search.proquest.com
Exposure to airborne pollutants, including gaseous toxins and particulate matter (PM),
threaten human health and are of growing world concern. Unfortunately, the specific …
threaten human health and are of growing world concern. Unfortunately, the specific …
Thermal Analysis of GaN/SiC-on-Si Assemblies: Effect of Bump Pitch and Thickness of SiC Layer
K Rasilainen, TMJ Nilsson, J Bremer… - … Investigations of ICs …, 2020 - ieeexplore.ieee.org
The ever-increasing requirements for high device performance and compact size drive the
communications industry to lookfor new materials, technologies, and integration concepts …
communications industry to lookfor new materials, technologies, and integration concepts …
A Novel Multifunctional Single-Layer Adhesive Used for both Temporary Bonding and Mechanical Debonding in Wafer-Level Packaging Applications
W Cheng, Y Wang, D Blumenshine… - 2021 China …, 2021 - ieeexplore.ieee.org
Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and
applied over the last decade in various wafer-level packaging technologies, such as …
applied over the last decade in various wafer-level packaging technologies, such as …
[图书][B] Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and Heterogeneous Multi-Chip 2.5 D Systems
MDA Kabir - 2021 - search.proquest.com
Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and
Heterogeneous Multi-Chip 2.5 D Systems Abstract Chip and packaging industries are …
Heterogeneous Multi-Chip 2.5 D Systems Abstract Chip and packaging industries are …