In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

First of all, semiconductor technology is out of the scope of this book and semiconductor
advanced packaging technology is the focus. In this chapter, the advanced packaging will …

The panel-level redistribution-layer (RDL)-first fan-out packaging for hybrid substrate is
studied. Emphasis is placed on the process, materials, design, and fabrication of: 1) …

To meet the requirements of low cost, thin vehicles, and multiple functions, the fan-out panel-
level packaging (FO-PLP) is introduced to be one of the next-generation packaging …

In the post-Moore era, advanced electronic packaging technology emerges as a prominent
direction for the future evolution of semiconductor industry. Nevertheless, warpage remains …

The fan-out panel-level chip-last packaging for heterogeneous integration is investigated.
Emphasis is placed on the design, materials, process, and fabrication of:(a) the …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Recently, heterogeneous integration of chiplets (chiplet heterogeneous integration or
heterogeneous chiplet integration) is getting lots of tractions [,,,,,,,,,,,,,,,,–]. Microprocessors …

In this study, the recent advances and trends of chip-let design and heterogeneous
integration packaging will be investigated. Emphasis is placed on the definition, kinds …

Redistribution layer (RDL) and through silicon via (TSV) are the two main important
packaging methods of the heterogeneous integration, here we report on the interconnection …