Recent advances and trends in fan-out wafer/panel-level packaging

JH Lau - Journal of Electronic Packaging, 2019 - asmedigitalcollection.asme.org
The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …
被引用次数：97 相关文章

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

JH Lau - asmedigitalcollection.asme.org
The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …

[引用][C] Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

JH Lau - 2019 - American Society of Mechanical …