Wearable electronics with miniaturization and high-power density call for devices with
advanced thermal management capabilities, outstanding flexibility, and excellent …

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass
supernumerary thermal heat is created in the repetitive course of deformation because of the …

Owing to the growing demand for highly integrated electronics, anisotropic heat dissipation
of thermal management material is a challenging and promising technique. Moreover, to …

Thermally conductive yet electrically insulating polymer composites are urgently required for
thermal management applications of modern electrical systems and electronic devices …

The rapid development of integrated circuits and electronic devices creates a strong
demand for highly thermally conductive yet electrically insulating composites to efficiently …

The continuous evolution toward semiconductor technology in the “more-than-Moore” era
and rapidly increasing power density of modern electronic devices call for advanced thermal …

The avoidance and mitigation of energy wastage have attracted increasing attention in the
context of global warming and climate change. With advances in materials science, diverse …

Efficient heat dissipation is a prerequisite for further improving the integration of devices.
However, the polymer composites are not satisfying heat dissipation. For that reason, high …

The accumulation of heat in electronic devices puts forward an urgent demand for thermal
interface materials. It is still a great challenge to achieve the good comprehensive …

Flexible and electrically insulating polymers are ideal heat dissipation packaging materials
for flexible electronic devices, but their inherent low thermal conductivity has gradually …