[图书][B] Advanced packaging
JH Lau, JH Lau - 2021 - Springer
First of all, semiconductor technology is out of the scope of this book and semiconductor
advanced packaging technology is the focus. In this chapter, the advanced packaging will …
advanced packaging technology is the focus. In this chapter, the advanced packaging will …
[图书][B] Microelectronics Packaging Handbook: Technology Drivers Part I
RR Tummala, EJ Rymaszewski, AG Klopfenstein - 2012 - books.google.com
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal
industries. It has become the industry of choice for a country to prosper, already having …
industries. It has become the industry of choice for a country to prosper, already having …
Packaging: past, present and future
RR Tummala - 2005 6th International Conference on Electronic …, 2005 - ieeexplore.ieee.org
In the past, microsystems packaging played two roles: 1) It provided I/O connections to and
from devices, referred to as IC or wafer level packaging, and 2) It interconnected both active …
from devices, referred to as IC or wafer level packaging, and 2) It interconnected both active …
Recent advances and trends in advanced packaging
JH Lau - IEEE Transactions on Components, Packaging and …, 2022 - ieeexplore.ieee.org
In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …
based on their interconnect density and electrical performance, and are grouped into 2-D …