This study adopted femtosecond laser with a wavelength of 515 nm to drill high-aspect-ratio
micro through holes on a 500-μm thickness single-crystal SI-type 4H-SiC wafer. Firstly …

Role of optical parameters on nanosecond laser drilling of 4H-SiC was experimentally
studied. Using ns pulsed Nd: YAG laser, parametric studies on effects of wavelength (1064 …

Due to the unique properties of femtosecond laser in precision machining, femtosecond
laser was utilized for irradiation on SiC/SiC composites. Effects of different processing …

A 3.5 mm thick SiCf/SiC material was drilled in air environment using a femtosecond laser
filament effect. The surface morphology of deep micropores was observed by scanning …

Picosecond laser machining is an important modern technology for materials with high
hardness. In this paper, micro-holes with several hundred micrometer diameter were drilled …

Femtosecond laser ablation has become one of the important structural processing methods
for the third-generation semiconductor material, silicon carbide (SiC), and it is gradually …

Abstract SiC/SiC (Silicon Carbide fiber reinforced Silicon Carbide) is widely used in
aerospace and gas turbine fields due to its excellent resistance to high temperature …

To solve SiC machining processes problems such as low processing efficiency,
surface/subsurface damage, and machining tool wear, a femtosecond-laser-aided …

Ultrashort pulse laser processing is a potential method for microfabricating silicon carbide
(SiC). However, it is difficult to precisely process SiC using this method because numerous …

The improvement of aero-engine performance posed a challenge to the heat dissipation
ability of blades, resulting in a substantial increase in the demand for micron-sized (≤ 1 mm) …