Toxicity of abrasive nanoparticles (SiO2, CeO2, and Al2O3) on Aliivibrio fischeri and human bronchial epithelial cells (16HBE14o-)

C Zeng, C Nguyen, S Boitano, JA Field… - Journal of Nanoparticle …, 2021 - Springer
Abstract SiO 2, CeO 2, and Al 2 O 3 nanoparticles (NPs) are used as abrasive particles in
chemical and mechanical planarization (CMP), a key process in semiconductor fabrication …
被引用次数：5 相关文章

Toxicity of abrasive nanoparticles (SiO2, CeO2, and Al2O3) on Aliivibrio fischeri and human bronchial epithelial cells (16HBE14o-)

C Zeng, C Nguyen, S Boitano, JA Field… - Journal of …, 2021 - ui.adsabs.harvard.edu
Abstract SiO 2, CeO 2, and Al 2 O 3 nanoparticles (NPs) are used as abrasive particles in
chemical and mechanical planarization (CMP), a key process in semiconductor fabrication …

Toxicity of abrasive nanoparticles (SiO2, CeO2, and Al2O3) on Aliivibrio fischeri and human bronchial epithelial cells (16HBE14o-)

C Zeng, C Nguyen, S Boitano, JA Field… - Journal of …, 2021 - search.ebscohost.com
Abstract SiO< sub> 2</sub>, CeO< sub> 2</sub>, and Al< sub> 2</sub> O< sub> 3</sub>
nanoparticles (NPs) are used as abrasive particles in chemical and mechanical …

Toxicity of abrasive nanoparticles (SiO2, CeO2, and Al2O3) on Aliivibrio fischeri and human bronchial epithelial cells (16HBE14o-)

C Zeng, C Nguyen, S Boitano, JA Field… - Journal of …, 2021 - search.proquest.com
Abstract SiO 2, CeO 2, and Al 2 O 3 nanoparticles (NPs) are used as abrasive particles in
chemical and mechanical planarization (CMP), a key process in semiconductor fabrication …