Nanoparticles (NPs) of silica, ceria and alumina are used as polishing slurries for Chemical
Mechanical Planarization (CMP). However, the regulations for use and toxic levels of ENPs …

This tutorial review focuses on aqueous slurries of dispersed engineered nanoparticles
(ENPs) used in chemical mechanical planarization (CMP) for polishing wafers during …

With the large-scale use of silica nanoparticles (SNPs) in Chemical Mechanical
Planarization (CMP) processes, it is very important to study their potential effect on human …

Chemical Mechanical Planarization (CMP) is a key enabling process used in semiconductor
manufacturing to achieve planarization. Contemporary CMP process use nanoparticle …

Chemical mechanical polishing (CMP) is a process that uses mechanical abrasive particles
and chemical interaction in slurry to remove materials from the surface of films. With …

Chemical mechanical planarization (CMP) is known to be one of the most challenging
processes in microelectronics manufacturing due to the number of variables involved in the …

Global planarization is one of the major demands of the semiconductor industry. Chemical
mechanical polishing (CMP) is the planarization method of choice use to achieve the …

Abstract Chemical Mechanical Planarization (CMP) is a process that is now routinely used to
planarize metal as well dielectric films during the fabrication of integrated circuits. This …

Chemical mechanical planarization (CMP) is a widely used technique for the manufacturing
of integrated circuit chips in the semiconductor industry. The process generates large …

Semiconductor chip manufacturers use slurries of metal oxide nanoparticles (NPs) as
abrasives in chemical mechanical planarization (CMP) processes on wafers containing films …