With the large-scale use of silica nanoparticles (SNPs) in Chemical Mechanical
Planarization (CMP) processes, it is very important to study their potential effect on human …

Nanoparticles (NPs) of silica, ceria and alumina are used as polishing slurries for Chemical
Mechanical Planarization (CMP). However, the regulations for use and toxic levels of ENPs …

Abstract Purpose Silica nanoparticles (SNPs) are increasingly used as drug delivery
systems (DDS) and for biomedical imaging. Therapeutic and diagnostic agents can be …

This tutorial review focuses on aqueous slurries of dispersed engineered nanoparticles
(ENPs) used in chemical mechanical planarization (CMP) for polishing wafers during …

Health risks from particles are a priority challenge to health protection at work. Despite the
ubiquitous exposure to a wide range of particles and the many years of research in this field …

Abstract SiO 2, CeO 2, and Al 2 O 3 nanoparticles (NPs) are used as abrasive particles in
chemical and mechanical planarization (CMP), a key process in semiconductor fabrication …

Chemical Mechanical Planarization (CMP) is a key enabling process used in semiconductor
manufacturing to achieve planarization. Contemporary CMP process use nanoparticle …

Despite increasing reports of using silica nanoparticles (SNPs) for controlled drug delivery
applications, their long-term toxicity profile following intravenous administration remains …

The nature of occupational risks and hazards in industries that produce or use synthetic
amorphous silica (SAS) nanoparticles is still under discussion. Manufactured SAS occur in …

In the semiconductor industry, chemical mechanical planarization (CMP) slurries are used in
large quantities for the planarization of wafers and the release of CMP nanoparticles (NPs) …