Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)
JH Lau, TG Yue - Microelectronics Reliability, 2012 - Elsevier
Thermal performances of 3D IC integration system-in-package (SiP) with TSV (through
silicon via) interposer/chip are investigated based on heat-transfer and CFD (computational …
silicon via) interposer/chip are investigated based on heat-transfer and CFD (computational …
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
Through-silicon via (TSV) technology enables 3D-integrated devices with higher
performance and lower cost as compared to 2D-integrated systems. This is mainly due to …
performance and lower cost as compared to 2D-integrated systems. This is mainly due to …
An innovative passive cooling method for high performance light-emitting diodes
A Fan, R Bonner, S Sharratt… - 2012 28th Annual IEEE …, 2012 - ieeexplore.ieee.org
Thermal management challenges are becoming a major roadblock to the wide use of high-
power LED lighting systems. Incremental improvements in conventional bulk metal heat …
power LED lighting systems. Incremental improvements in conventional bulk metal heat …
Innovative through-silicon-via formation approach for wafer-level packaging applications
CW Tang, HT Young, KM Li - Journal of Micromechanics and …, 2012 - iopscience.iop.org
Through-silicon via (TSV) is an emerging technology for three-dimensional integrated circuit,
system-in-packaging and wafer-level packaging applications. Among several available TSV …
system-in-packaging and wafer-level packaging applications. Among several available TSV …
大功率集成封装白光LED 模组的散热研究
侯峰泽， 杨道国， 唐红雨， 崔在甫， 贾红亮 - 电子元件与材料, 2012 - cqvip.com
采用有限元分析软件ANSYS, 分别对基于均温基板和金属芯印刷电路板结合太阳花散热器的100
W 的大功率集成封装白光LED 进行了热分析. 结果发现:(1) 相比金属芯印刷电路板 …
W 的大功率集成封装白光LED 进行了热分析. 结果发现:(1) 相比金属芯印刷电路板 …
High aspect ratio TSVs fabricated by magnetic self-assembly of gold-coated nickel wires
Three-dimensional (3D) integration is an emerging technology that vertically interconnects
stacked dies of electronics and/or MEMS-based transducers using through silicon vias …
stacked dies of electronics and/or MEMS-based transducers using through silicon vias …
A study of novel wafer level LED package based on TSV technology
D Chen, L Zhang, Y Xie, KH Tan… - 2012 13th International …, 2012 - ieeexplore.ieee.org
LED (light-emitting diode) has many advantages over traditional lighting source such as
higher electrical efficiency, faster response, and free of hazardous, which has been …
higher electrical efficiency, faster response, and free of hazardous, which has been …
Wafer level system packaging and integration for solid state lighting (SSL)
X Fan - 2012 13th International Thermal, Mechanical and Multi …, 2012 - ieeexplore.ieee.org
In this paper, wafer level system packaging and integration for solid state lighting (SSL) is
presented, which includes wafer level phosphor coating, wafer level LED chip …
presented, which includes wafer level phosphor coating, wafer level LED chip …
Integration and Fabrication Techniques for 3D Micro-and Nanodevices
AC Fischer - 2012 - diva-portal.org
The development of micro and nano-electromechanical systems (MEMS and NEMS) with
entirely new or improved functionalities is typically based on novel or improved designs …
entirely new or improved functionalities is typically based on novel or improved designs …
Reliability Considerations for Advanced and Integrated LED Systems
XJ Fan - Solid State Lighting Reliability: Components to …, 2012 - Springer
This chapter presents an overview of advanced packaging and integration of solid state
lighting (SSL) systems. A full realization of wafer level SSL system integration requires wafer …
lighting (SSL) systems. A full realization of wafer level SSL system integration requires wafer …