Overview and outlook of three-dimensional integrated circuit packaging, three-dimensional Si integration, and three-dimensional integrated circuit integration
JH Lau - Journal of Electronic Packaging, 2014 - asmedigitalcollection.asme.org
3D integration consists of 3D integrated circuit (IC) packaging, 3D Si integration, and 3D IC
integration. They are different and in general the through-silicon via (TSV) separates 3D IC …
integration. They are different and in general the through-silicon via (TSV) separates 3D IC …
High-aspect-ratio through silicon vias for high-frequency application fabricated by magnetic assembly of gold-coated nickel wires
In this paper, we demonstrate a novel manufacturing technology for high-aspect-ratio
vertical interconnects for high-frequency applications. This novel approach is based on …
vertical interconnects for high-frequency applications. This novel approach is based on …
High heat flux heat pipes embedded in metal core printed circuit boards for LED thermal management
D Pounds, RW Bonner - Fourteenth Intersociety Conference on …, 2014 - ieeexplore.ieee.org
As LED applications continue to expand beyond lighting and sensors, the power levels and
heat dissipation requirements will also continue to increase. Thermal management is …
heat dissipation requirements will also continue to increase. Thermal management is …
Blue selective photodiodes for optical feedback in LED wafer level packages
ZK Esfahani, T Ma, H van Zeijl… - 2014 44th European …, 2014 - ieeexplore.ieee.org
Recently applying an intelligent self-curing system to get a feedback from the LED light in
order to control its intensity with driving current has attracted so much attention. This study …
order to control its intensity with driving current has attracted so much attention. This study …
High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performance
L Wang, G Guevara, G Villavicencio… - International …, 2014 - meridian.allenpress.com
The market share of high-brightness LEDs in general lighting has been rapidly expanding
mainly owing to the continued technological advances on internal quantum efficiency, light …
mainly owing to the continued technological advances on internal quantum efficiency, light …
Wafer level LED packaging with optimal light output and thermal dissipation for high-brightness lighting
L Wang, G Guevara, H Shaba… - 2014 IEEE 64th …, 2014 - ieeexplore.ieee.org
Market size of high-brightness LED lighting has been rapidly growing upon the continual
improvement of quantum efficiency and light extraction. However some key breakthroughs …
improvement of quantum efficiency and light extraction. However some key breakthroughs …
Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM
S Belhenini, A Tougui, F Dosseul - 2014 15th International …, 2014 - ieeexplore.ieee.org
3D microelectronic components are exposed to electrical, thermal, mechanical and chemical
stresses generated by storage, transport, manipulation, functioning and environment. The …
stresses generated by storage, transport, manipulation, functioning and environment. The …
Thermal Effects Analysis of Flip Chip LED Packages with through Silicon via (TSV) by Using Numerical Simulation
CH Chien, BS Chen, YD Wu - Applied Mechanics and Materials, 2014 - Trans Tech Publ
With advancement of technology, package sizes and products are becoming smaller due to
miniaturization. Separate light-emitting diode (LED) chips and control integrated circuits with …
miniaturization. Separate light-emitting diode (LED) chips and control integrated circuits with …
[引用][C] Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM
B Soufyane, T Abdellaha, D Franck - 2014 - dspace.univ-temouchent.edu.dz
Abstract 3D microelectronic components are exposed to electrical, thermal, mechanical and
chemical stresses generated by storage, transport, manipulation, functioning and …
chemical stresses generated by storage, transport, manipulation, functioning and …