Effect of covalent functionalization and phase change matrix on heat transfer across graphene/phase change material interfaces
Y Liu, D Zhang - Applied Thermal Engineering, 2019 - Elsevier
Owing to the superior thermal conductivity (TC) of graphene, graphene/phase change
material (G/PCM) have the potential as the thermal interface materials (TIMs) dissipating …
material (G/PCM) have the potential as the thermal interface materials (TIMs) dissipating …
Partial coaxial through-silicon via for suppressing the substrate noise in 3-dimensional integrated circuit
J Su, W Zhang, C Yao - IEEE Access, 2019 - ieeexplore.ieee.org
In this paper, a novel through-silicon via (TSV) structure, named partial coaxial TSV (PC-
TSV), is proposed to suppress TSV-induced substrate noise. In this structure, the via is …
TSV), is proposed to suppress TSV-induced substrate noise. In this structure, the via is …
White LEDs with high optical consistency packaged using 3D ceramic substrate
H Cheng, Y Mou, Y Peng… - IEEE Photonics …, 2019 - ieeexplore.ieee.org
Packaging efficiency and optical performances are important indexes for white light-emitting
diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by …
diodes (WLEDs) packaging. In this letter, wafer-level WLEDs packaging were presented by …
Heterogeneous Integration of CIS, LED, MEMS, and VCSEL
JH Lau, JH Lau - Heterogeneous Integrations, 2019 - Springer
In this chapter, the heterogeneous integration of CIS (CMOS image sensor), heterogeneous
integration of LED (light-emitting diode), heterogeneous integration of MEMS …
integration of LED (light-emitting diode), heterogeneous integration of MEMS …