3D LED and IC wafer level packaging

Die attachment, wire bonding, and encapsulation process in LED packaging: A review

MA Alim, MZ Abdullah, MSA Aziz… - Sensors and Actuators A …, 2021 - Elsevier
Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …
被引用次数：50 相关文章 所有 3 个版本

Fan-out panel-level packaging of mini-LED RGB display

JH Lau, CT Ko, C Lin, TJ Tseng… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a
chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design …
被引用次数：17 相关文章

Design, materials, process, fabrication, and reliability of mini-LED RGB display by fan-out panel-level packaging

JH Lau, CT Ko, C Lin, TJ Tseng… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
In this study, the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-
level packaging is investigated. Emphasis is placed on the design, materials, process …
被引用次数：3 相关文章

2.5 D IC Integration

JH Lau, JH Lau - Semiconductor Advanced Packaging, 2021 - Springer
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被引用次数：1 相关文章

Fan-Out Wafer/Panel-Level Packaging

JH Lau, JH Lau - Semiconductor Advanced Packaging, 2021 - Springer
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