Recent advances and trends in advanced packaging

JH Lau - IEEE Transactions on Components, Packaging and …, 2022 - ieeexplore.ieee.org
In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

Development of LED package heat dissipation research

P Liu, C She, L Tan, P Xu, L Yan - Micromachines, 2022 - mdpi.com
LEDs are widely used in medicine, navigation and landscape lighting. The development of
high-power LED is a severe challenge to LED heat dissipation. In this review, packaging …

Opto-thermal performances investigation of high-power WLEDs with different reflective dams

Z Lei, J Liu, Y Mou, J Liu, Y Peng… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
Reflective dam is a common structure in white light-emitting diodes (WLEDs) packaging due
to its advantages of light regulation, heat conduction, and enhanced packaging efficiency. In …

Panel level IC-package technology development

JK Fang, CM Fong, WL Lu, P Yang - Microelectronics Reliability, 2022 - Elsevier
Abstract The Fifth and Sixth Generation wireless strong demands driving IC-Package
development into a newly formed in higher performance, more heterogeneous integration …

Case Study-Based Report on Solid-State Lighting

MM Khan - 2022 Advances in Science and Engineering …, 2022 - ieeexplore.ieee.org
Solid-State Lighting (SSL) is the encouraging energy saver key for imminent lighting
operations. In this paper, we've studied varied aspects considering countertrend and …