Recent advances and trends in multiple system and heterogeneous integration with TSV interposers
JH Lau - IEEE Transactions on Components, Packaging and …, 2023 - ieeexplore.ieee.org
In this study, the recent advances and trends in multiple system and heterogeneous
integration with through-silicon via (TSV) interposers will be investigated. Emphasis is …
integration with through-silicon via (TSV) interposers will be investigated. Emphasis is …
State-of-the-art of advanced packaging
JH Lau - Chiplet Design and Heterogeneous Integration …, 2023 - Springer
In this chapter, advanced packaging is defined. The kinds of advanced packaging are
ranked based on their interconnect density and electrical performance, and are grouped into …
ranked based on their interconnect density and electrical performance, and are grouped into …
Multiple System and Heterogeneous Integration with TSV-Interposers
JH Lau - Chiplet Design and Heterogeneous Integration …, 2023 - Springer
As mentioned in Chaps. 1 and 2 and Lau in IEEE Trans CPMT 12: 1271–1281 (2022), there
are at least three different multiple system and heterogeneous integration packaging, as …
are at least three different multiple system and heterogeneous integration packaging, as …