Recently, the need for miniaturization and high integration have steered a strong technical
wave in developing (micro‐) electronic devices. However, excessive amounts of heat may …

As the currently predominant thermoset plastic, epoxy thermoset is widely used in composite
materials, electronic packaging materials, coatings and adhesives. The rapid rise in epoxy …

The rapid increase in the use of plastics and the related sustainability issues, including the
depletion of global petroleum reserves, have rightly sparked interest in the use of biobased …

This paper describes a method to improve the thermal conductivity, mechanical properties
and thermal dimensional stability of polyimide-based composites by rationally introducing …

Polydimethylsiloxane containing methacryloyloxy and methoxy silane groups (MAPDMS)-
microcapsule-SiO2 (MPMS) functional materials were prepared by constructing micro-nano …

Reprocessable thermally conductive polymer composites with excellent thermal
management performance have become the research hotspot in order to solve the heat …

The development of bio-based thermosets with favorable mechanical properties, high glass
transition temperature (T g), and recyclability for thermal management applications remains …

The weak internal cohesion and initial viscosity of soy protein adhesives lead to the poor
cold-pressing bonding performance of plywood preparation. This deficiency restricted the …

With the rapid evolution of integrated circuits and electronic devices, considerable research
efforts are dedicated to thermally conductive but electrically insulative composites that may …

With the advancement of electronic devices, the generation of heat and electromagnetic
(EM) waves has increased. Therefore, it is essential to properly manage these heat and EM …