Fan-Out Technology
JH Lau - Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out …, 2024 - Springer
There are eight different topics in this chapter.(1) chip-first with die face-down for
heterogeneous integration of 4 chips and 4 capacitors,(2) chip-first with die face-down for …
heterogeneous integration of 4 chips and 4 capacitors,(2) chip-first with die face-down for …
Recent advances and trends in chiplet design and heterogeneous integration packaging
JH Lau - Journal of Electronic Packaging, 2024 - asmedigitalcollection.asme.org
In this study, chiplet design and heterogeneous integration packaging, especially (a) chip
partition and heterogeneous integration driven by cost and technology optimization, Figs. 1 …
partition and heterogeneous integration driven by cost and technology optimization, Figs. 1 …