Autoclave process parameters affecting mechanical and thermomechanical properties of CFRP laminates using response surface methodology

A Baghad, K El Mabrouk - Journal of Reinforced Plastics …, 2024 - journals.sagepub.com
Autoclave curing is a manufacturing process for high-performance parts based on carbon
fiber–reinforced polymers (CFRPs) used for large aircraft parts. Today, this manufacturing …

[HTML][HTML] Development of a Cure Model for Unsaturated Polyester Resin Systems Based on Processing Conditions

A Barakat, M Al Ghazal, RS Fono Tamo, A Phadatare… - Polymers, 2024 - mdpi.com
Unsaturated polyester resin (UPR) systems are extensively used in composite materials for
applications in the transportation, marine, and infrastructure sectors. There are continually …

Near-infrared spectroscopy in resin transfer molding—determination of the degree of cure

M Salzmann, W Märzinger, M Teuchtmann… - … International Journal of …, 2024 - Springer
Near-infrared (NIR) spectroscopy is employed to directly monitor the degree of cure of
composite material during the curing phase in the resin transfer molding (RTM) process. The …

Cure-induced Shape Distortion and Process Modeling of Thin-shell Structures

DK Patel, AD Hasanyan - AIAA SCITECH 2024 Forum, 2024 - arc.aiaa.org
The curing process modeling and the resultant deformed shape of a composite boom
structure is presented to study the effects of curing parameters that can be detrimental to the …

[PDF][PDF] TOWARDS A PRACTICAL METHOD FOR MONITORING KINETIC PROCESSES IN POLYMERS WITH LOW-FREQUENCY RAMAN SPECTROSCOPY

RV Chimenti - 2024 - rdw.rowan.edu
Unlike liquids and crystalline solids, glassy materials exist in a constant state of structural
nonequilibrium. Therefore, a comprehensive understanding of material kinetics is critical for …

The Effective Cure Shrinkage of Underfill and its Effects on the Reliability of Flip Chip Package

J Bao, L Peng, Y Zhou, J Chen, Y Yang… - 2024 25th …, 2024 - ieeexplore.ieee.org
Underfill (UF) is an important material for improving the reliability of flip chip interconnection
in advanced packaging. How the curing process of underfill in the packaging process affects …

Curing Kinetics of Epoxy Resin for General Aviation Aircraft Composites.

D Zhen-yuan, C Shu-xian - Plastics Science & Technology …, 2024 - search.ebscohost.com
In order to obtain the curing kinetic equation and curing kinetic parameters of thermosetting
epoxy resin for general aviation aircraft, the non-isothermal test of thermosetting epoxy resin …