Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect
G Wan, Q Dong, X Sun, H Zheng, M Cheng… - Microelectronics …, 2024 - Elsevier
This study introduces a cross-scale numerical analysis approach for modeling the
lamination process and predicting the post-lamination warping deformation of Printed Circuit …
lamination process and predicting the post-lamination warping deformation of Printed Circuit …