Purpose–The purpose of this paper is to compare the reliability and intermetallic layer (IML)
of solder joints prepared with infrared (IR) and vapour phase (VP) soldering. The reliability of …

This study introduces a cross-scale numerical analysis approach for modeling the
lamination process and predicting the post-lamination warping deformation of Printed Circuit …

In this paper, the warpage simulation of a high-density multilayer printed circuit board (PCB)
for solid-state disk drive (SSD) and microelectronic package was performed using the …

To meet the future needs of high pin count and high performance, package size of flip-chip
devices is constrained to become larger. In addition, to fulfill the environment issues, lead …

A steady laminar flow coupled with heat transfer, gas-phase chemistry, and surface
chemistry model, was numerically solved for optimization of thermal chemical vapor …

Printed Circuit Board (PCB) warpage increases as thickness decreases and ultimately is
attributed to CTE mismatch and thickness geometry of the components. Recently, a thin Ball …

In our experiment the mechanical strength of solder joints formed by Vapor Phase soldering
was investigated. A testboard was designed, which allowed fifty pieces of 0603 size chip …

Reliability characteristics of thin package-on-packages were evaluated using T/H
(temperature/humidity) test at $85^{\circ} C/85% $ for 500 hours, TC (temperature cycling) …

In our experiment the intermetallic layer (IML) formation during Infrared (IR) and Vapour
Phase (VP) soldering was investigated. A testboard was designed, onto which fifty pieces of …

The existence of defects in the corresponding interfaces can gradually degrade the
interfacial adhesion when the flip chip package is exposed to the high temperature and …